Printed Circuit Board Based Rotating Coils for Measuring Sextupole Magnets

JOURNAL ARTICLE published August 2024 in IEEE Transactions on Applied Superconductivity

Research funded by Fermi Research Alliance, LLC (DE-AC02-07CH11359)

Authors: J. DiMarco

Theory vs. Reality: Using Printed Circuit Board Technology for Grounded Coplanar Waveguide at Millimeter-Wave Frequencies: Understanding PCB Technology for Millimeter-Wave Applications

JOURNAL ARTICLE published May 2024 in IEEE Microwave Magazine

Authors: John Coonrod

Design and Fabrication of Enzymatic Potentiometric Biosensor Based on Flexible Printed Circuit Board for Glucose Detection

JOURNAL ARTICLE published April 2024 in IEEE Transactions on NanoBioscience

Research funded by National Science and Technology Council, Taiwan (NSTC 112-2221-E-224-049)

Authors: Po-Yu Kuo | Chi-Han Liao | Tai-Hui Wang | Ming-Tai Hsu

Ceramic Column Grid Array (CCGA) Solder Voiding on Interstellar Mapping and Acceleration Probe (IMAP) Printed Circuit Board Assemblies (PCBAs)

PROCEEDINGS ARTICLE published 2 March 2024 in 2024 IEEE Aerospace Conference

Authors: Anna Shin | Allen Keeney | Matthew Woodard | Neil Dalal

Multi-objective Design Optimization For High-bandwidth Printed-Circuit-Board Shielded Rogowski Coils

PROCEEDINGS ARTICLE published 25 February 2024 in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC)

Authors: Xingyue Tian | Sadia Binte Sohid | Han Cui | Fred Wang | Jason Swaim | Michael Zimmermann

Semianalytically Designed Dual-Polarized Printed-Circuit-Board (PCB)-Compatible Metagratings

JOURNAL ARTICLE published February 2024 in IEEE Transactions on Antennas and Propagation

Research funded by Israel Science Foundation (1540/18)

Authors: Yuval Shklarsh | Ariel Epstein

Theoretical and Experimental Investigation of a Wireless Passive Pressure Sensor Based on Flexible Printed Circuit Board Technology

JOURNAL ARTICLE published 1 February 2024 in IEEE Sensors Journal

Research funded by National Natural Science Foundation of China (52105582) | Natural Science Foundation of Guangdong Province (2022A1515010894) | Shenzhen Science and Technology Program (JCYJ20210324095210030,JCYJ20220818095810023,ZDSYS20220527171402005) | Shenzhen-Hong Kong-Macau Science and Technology Program Category C (SGDX20210823103200004)

Authors: Chuandu Zhang | Linze Hong | Xiaofang Pan | Yu-Xiang Sun | Wei Xu

Dielectric Characterization for Secure and Reliable High-Frequency Printed Circuit Board Applications

PROCEEDINGS ARTICLE published 8 January 2024 in 2024 IEEE 1st Karachi Section Humanitarian Technology Conference (KHI-HTC)

Authors: Sayed Md Tashfi Nowroz | Fathi Amsaad | Nz Jhanjhi

Potentiometric MgO Film pH Sensor Measurement Analysis and Integrated Flexible Printed Circuit Board

JOURNAL ARTICLE published 2024 in IEEE Journal of the Electron Devices Society

Research funded by National of Science and Technology Council, Republic of China (NSTC 111-2221-E-224-058,NSTC 112-2221-E-224-049)

Authors: Po-Hui Yang | Jyun-Ming Huang | Ying-Sheng Chang | Che-Tsung Chan | Wei-Shun Chen

Fast Calculation Method for Crosstalk of High-Density Printed Circuit Board by Using Machine Learning

JOURNAL ARTICLE published 2024 in IEEE Transactions on Electromagnetic Compatibility

Research funded by Beijing Municipal Natural Science Foundation (L233017)

Authors: Dan Shi | Na Sun | Yanchi Liu | Cheng Lian | Xingyu Chen | Xiaoya Zhou | Xiaoyong Liu | Qiwei Liu | Juejia Zhou

Design of a Printed Circuit Board Axial Flux Permanent Magnet Machine for High Speed Applications

JOURNAL ARTICLE published 2024 in IEEE Transactions on Industry Applications

Authors: Federico Marcolini | Giulio De Donato | Fabio Giulii Capponi | Federico Caricchi

Visual Geometry Group Network for Flexible Printed Circuit Board Surface Defect Classification

JOURNAL ARTICLE published 2024 in IEEE Canadian Journal of Electrical and Computer Engineering

Research funded by National Key Research and Development Program of China (2019YFB1704600) | Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration (EMPI2023024) | Wuhan East Lake District Unveiling the List of Hanging Project (2022KJB101)

Authors: Jiazheng Sheng | Siyi Guo | Hui Li | Shengnan Shen | Yikai Zhang | Yicang Huang | Bin Sun | Jian Wang

Enhancing EfficientNet-YOLOv4 for Integrated Circuit Detection on Printed Circuit Board (PCB)

JOURNAL ARTICLE published 2024 in IEEE Access

Research funded by Collaborative Research in Engineering, Science and Technology Centre (Project P08C1-20 ?Image Data Analytics for Indus)

Authors: Tay Shiek Chi | Mohd Nadhir Ab Wahab | Ahmad Sufril Azlan Mohamed | Mohd Halim Mohd Noor | Khaw Beng Kang | Lim Lay Chuan | Liau Wei Jie Brigitte

Synthetic Data Generation for Text Spotting on Printed Circuit Board Component Images

JOURNAL ARTICLE published 2024 in IEEE Access

Research funded by Western Digital (Sandisk Storage Malaysia Sdn. Bhd.) under CREST Research and Development Project “Image Data Analytics for Industry 4.0” (P08C1-20)

Authors: Wei Jie Brigitte Liau | Shiek Chi Tay | Ahmad Sufril Azlan Mohamed | Mohd Nadhir Ab Wahab | Lay Chuan Lim | Beng Kang Khaw | Mohd Halim Mohd Noor

Defect Detection Model of Printed Circuit Board Components Based on the Fusion of Multi-Scale Features and Efficient Channel Attention Mechanism

JOURNAL ARTICLE published 2024 in IEEE Access

Research funded by Science and Technology Research Program Project of Chongqing Municipal Education Commission (KJZD-K202203601) | School-Level Project of Chongqing University of Science and Technology (ckrc2020009) | Project of Deep Learning-Based Online Detection of Assembly Defects in Printed Circuit Board Components (19230101029)

Authors: Wenbin Chen | Hongchao Zhao | Zheng Wang

Thermal Analysis and Simulation of Quad Flat No-Leads Packaging on Printed Circuit Board with ANSYS

PROCEEDINGS ARTICLE published 15 December 2023 in 2023 IEEE 7th Conference on Energy Internet and Energy System Integration (EI2)

Authors: Junyan Fu | Hui Huang | Chi Zhang

Life assessment of Micro-via used in thin Printed Circuit Board under Thermal Cycling loads & influence of selected design parameters

PROCEEDINGS ARTICLE published 5 December 2023 in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

Authors: Vinay Kumar | Shrikant Bhadri

Optimization Design Method for Printed Circuit Board Self-Resonant Coil

PROCEEDINGS ARTICLE published 10 November 2023 in 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)

Authors: Yang Liu | Fuyao Yang | Yu Han | Jie Gao | Hao Sun | Cong Wang | Yueshi Guan | Ruiqing Sun

Ant Colony Algorithm for Placing Electronic Components on a Printed Circuit Board, Taking into Account the Thermal Compatibility Criterion^*

PROCEEDINGS ARTICLE published 10 November 2023 in 2023 IEEE XVI International Scientific and Technical Conference Actual Problems of Electronic Instrument Engineering (APEIE)

Authors: Ilya V. Suzdaltsev | Vladimir A. Suzdaltsev | Nelli Y. Bogula

Novel Frequency-Selective Surfaces for Printed Circuit Board-Based Wireless Power Resonators with High Quality Factors

PROCEEDINGS ARTICLE published 10 November 2023 in 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)

Research funded by Ministry of Education (MoE) Academic Research Fund (AcRF) Tier-1 (RG116/21)

Authors: Zhen Sun | Kaiyuan Wang | Yuan Mao | Jianghao Hu | Wenxing Zhong | Yun Yang